Electronic device

ABSTRACT

An electronic device includes: a substrate having an upper surface and a lower surface; a first electronic component mounted on the upper surface of the substrate; a second electronic component mounted on the lower surface of the substrate; and a mold portion covering the second electronic component without covering the first electronic component. The first electronic component is bonded to the upper surface on the first relative surface via a conductive first bonding member. The second electronic component is bonded to the lower surface via a second bonding member on a second relative surface relative to the lower surface.

The present application is based on, and claims priority from JPApplication Serial Number 2020-152562, filed Sep. 11, 2020, thedisclosure of which is hereby incorporated by reference herein in itsentirety.

BACKGROUND 1. Technical Field

The present disclosure relates to an electronic device.

2. Related Art

A piezoelectric device disclosed in JP-A-2007-173431 includes asubstrate, a piezoelectric vibrator and a semiconductor chip mounted onan upper surface of the substrate, and a mold material for molding thepiezoelectric vibrator and the semiconductor chip. The piezoelectricvibrator is bonded to the substrate via solder, and the solder serves asa spacer to form a minute gap between the substrate and thepiezoelectric vibrator.

However, in the above-described configuration, since the gap between thesubstrate and the piezoelectric vibrator is minute, filling of the moldmaterial into the gap is insufficient, and the gap may not be completelyfilled. As described above, when the piezoelectric device in which thegap between the substrate and the piezoelectric vibrator is notcompletely filled with the mold material is solder-mounted on anexternal substrate such as a motherboard, the solder bonding thepiezoelectric vibrator and the substrate may be melted by the heat, andthe melted solder may wet and spread in the gap to cause a shortcircuit.

SUMMARY

An electronic device according to the present disclosure includes: asubstrate having a first surface and a second surface that are in afront and back relationship with each other, a first wiring patternbeing disposed on the first surface, and a second wiring pattern beingdisposed on the second surface; a first electronic component mounted onthe first surface of the substrate; a second electronic componentmounted on the second surface of the substrate; and a mold portion thatcovers the second electronic component without covering the firstelectronic component, in which the first electronic component includes afirst mounting terminal disposed on a first relative surface relative tothe first surface, and is bonded to the first surface on the firstrelative surface via a conductive first bonding member, and the firstmounting terminal and the first wiring pattern are electrically coupledto each other via the first bonding member, and the second electroniccomponent includes a second mounting terminal, and is bonded to thesecond surface via a second bonding member on a second relative surfacerelative to the second surface, and the second mounting terminal and thesecond wiring pattern are electrically coupled to each other via aconductive wire.

An electronic device according to the present disclosure includes: asubstrate having a first surface and a second surface that are in afront and back relationship with each other, a first wiring patternbeing disposed on the first surface, and a second wiring pattern beingdisposed on the second surface; a first electronic component mounted onthe first surface of the substrate; a second electronic componentmounted on the second surface of the substrate; and a mold portion thatcovers the second electronic component without covering the firstelectronic component, in which the first electronic component includes afirst mounting terminal disposed on a first relative surface relative tothe first surface, and is bonded to the first surface on the firstrelative surface via a conductive first bonding member, and the firstmounting terminal and the first wiring pattern are electrically coupledto each other via the first bonding member, and the second electroniccomponent includes a second mounting terminal disposed on a secondrelative surface relative to the second surface, and is bonded to thesecond surface on the second relative surface via a conductive secondbonding member having a melting point higher than that of the firstbonding member, and the second mounting terminal and the second wiringpattern are electrically coupled to each other via the second bondingmember.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view showing an electronic device according to afirst embodiment.

FIG. 2 is a plan view showing inside of a cap of the electronic deviceshown in FIG. 1 .

FIG. 3 is a cross-sectional view taken along a line A-A in FIG. 2 .

FIG. 4 is a flowchart showing manufacturing steps of the electronicdevice shown in FIG. 1 .

FIG. 5 is a plan view showing a lead frame.

FIG. 6 is a cross-sectional view for illustrating a method ofmanufacturing the electronic device.

FIG. 7 is a cross-sectional view for illustrating the method ofmanufacturing the electronic device.

FIG. 8 is a cross-sectional view for illustrating the method ofmanufacturing the electronic device.

FIG. 9 is a cross-sectional view for illustrating the method ofmanufacturing the electronic device.

FIG. 10 is a cross-sectional view for illustrating the method ofmanufacturing the electronic device.

FIG. 11 is a cross-sectional view showing an electronic device accordingto a second embodiment.

FIG. 12 is a cross-sectional view showing an electronic device accordingto a third embodiment.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Hereinafter, an electronic device according to an aspect of the presentdisclosure will be described in detail based on an embodimentillustrated in the accompanying drawings. For convenience ofillustration, three axes orthogonal to one another are illustrated as anX axis, a Y axis, and a Z axis in each of the drawings except for FIG. 4. A direction parallel to the X axis is also referred to as an “X axisdirection”. A direction parallel to the Y axis is also referred to as a“Y axis direction”. A direction parallel to the Z axis is also referredto as a “Z axis direction”. A tip end side of an arrow indicating eachaxis is also referred to as a “positive side”. An opposite side thereofis also referred to as a “negative side”. The positive side in the Zaxis direction is also referred to as “upper”. The negative side in theZ axis direction is also referred to as “lower”.

First Embodiment

FIG. 1 is a perspective view showing an electronic device according to afirst embodiment. FIG. 2 is a plan view showing inside of a cap of theelectronic device shown in FIG. 1 . FIG. 3 is a cross-sectional viewtaken along a line A-A in FIG. 2 . FIG. 4 is a flowchart showingmanufacturing steps of the electronic device shown in FIG. 1 . FIG. 5 isa plan view showing a lead frame. FIGS. 6 to 10 are cross-sectionalviews for illustrating a method of manufacturing the electronic device.In FIG. 2 , a first wiring pattern is not shown for convenience ofillustration.

An electronic device 1 shown in FIG. 1 has a quad flat package (QFP)structure. As shown in FIGS. 2 and 3 , the electronic device 1 includesa substrate 2, a first electronic component 3 located on an uppersurface 21 side of the substrate 2 and bonded to the upper surface 21, asecond electronic component 4 located on a lower surface 22 side of thesubstrate 2 and bonded to the lower surface 22, a lead group 7 includinga plurality of leads 71 bonded to the lower surface 22 of the substrate2, a cap 8 covering the substrate 2 so as to cover the first electroniccomponent 3, and a mold portion 9 that molds and seals the secondelectronic component 4 and bonds the cap 8 to the substrate 2. Theelectronic device 1 includes three angular velocity sensors 3 x, 3 y,and 3 z as the first electronic component 3, and includes anacceleration sensor 5 and a circuit element 6 as the second electroniccomponent 4.

The substrate 2 has a substantially square plate shape in a plan view,and has the upper surface 21 as a first surface and the lower surface 22as a second surface which are in a front and back relationship with eachother. The substrate is a ceramic substrate and is made of variousceramic materials such as alumina and titania. When the ceramicsubstrate is used as the substrate 2, the substrate 2 has high corrosionresistance. The substrate 2 having excellent mechanical strength isobtained. Since moisture absorption is less likely to occur and heatresistance is excellent, damage due to heat applied at the time ofmanufacturing the electronic device 1 is less likely to occur. By usingthe same material as that of a base 32 included in the angular velocitysensors 3 x, 3 y, and 3 z, thermal stress due to a linear expansioncoefficient difference is less likely to occur therebetween. Therefore,the electronic device 1 having excellent long-term reliability isobtained. The substrate 2 is not limited to a ceramic substrate. Forexample, various semiconductor substrates, various glass substrates, andvarious printed substrates can also be used.

A first wiring pattern 28 electrically coupled to the first electroniccomponent 3 is disposed on the upper surface 21 of the substrate 2. Onthe other hand, a second wiring pattern 29 electrically coupled to thesecond electronic component 4 is disposed on the lower surface 22 of thesubstrate 2. The first wiring pattern 28 is electrically coupled to thesecond wiring pattern 29 via a through electrode, which is not shown,formed in the substrate 2.

The first electronic component 3 is a packaged surface mount component.Accordingly, it is possible to exhibit higher mechanical strength than amount component in which an element is exposed. The first electroniccomponent can be easily mounted on the substrate 2. The first electroniccomponent 3 is a physical quantity sensor. In particular, in the presentembodiment, three angular velocity sensors 3 x, 3 y, and 3 z areprovided. The angular velocity sensor 3 x is a sensor that detects anangular velocity around the X axis. The angular velocity sensor 3 y is asensor that detects an angular velocity around the Y axis. The angularvelocity sensor 3 z is a sensor that detects an angular velocity aroundthe Z axis. By using the first electronic component 3 as the physicalquantity sensor, the electronic device 1 that is suitably mounted onvarious electronic devices and mobile bodies is obtained. Therefore,convenience and demand of the electronic device 1 are increased. Inparticular, since the electronic device 1 can detect the angularvelocities about three axes orthogonal to one another, the above effectis more remarkable.

Basic configurations of the angular velocity sensors 3 x, 3 y, and 3 zare the same as one another. The angular velocity sensors 3 x, 3 y, and3 z are mounted in different postures so that detection axes face theX-axis direction, the Y-axis direction, and the Z-axis direction. Asshown in FIG. 3 , each of the angular velocity sensors 3 x, 3 y, and 3 zincludes a package 31 and a physical quantity detection element 34accommodated in the package 31. The package 31 includes a box-shapedbase 32 having a recess 321, and a lid 33 bonded to the base 32 so as toclose an opening of the recess 321. The base 32 is constituted by aceramic material such as alumina. The lid 33 is constituted by a metalmaterial such as Kovar.

As shown in FIG. 3 , a plurality of first mounting terminals 39electrically coupled to the physical quantity detection element 34 aredisposed on a lower surface of the package 31, that is, a first relativesurface 320 relative to the upper surface 21 of the substrate 2. Thephysical quantity detection element 34 is, for example, a crystalvibration element having a drive arm and a vibration arm. In such acrystal vibration element, when the angular velocity around thedetection axis is applied in a state where a drive signal is applied todrive and vibrate the drive arm, detection vibration is excited in thedetection arm by Coriolis force. Electric charge generated in thedetection arm by the detection vibration is extracted as a detectionsignal. The angular velocity can be obtained based on the extracteddetection signal.

Each of the angular velocity sensors 3 x, 3 y, and 3 z is bonded to theupper surface 21 of the substrate 2 via a conductive first bondingmember B1 on the first relative surface 320. The first mounting terminal39 of each of the angular velocity sensors 3 x, 3 y, and 3 z iselectrically coupled to the first wiring pattern 28 via the firstbonding member B1. The first bonding member B1 is solder, andmechanically and electrically couples the angular velocity sensors 3 x,3 y, and 3 z to the substrate 2 by solder reflow. Accordingly, it ispossible to easily and accurately couple the angular velocity sensors 3x, 3 y, and 3 z to the substrate 2. The first bonding member B1 is lessdeteriorated over time and has high reliability. The first bondingmember B1 is not limited to solder. For example, various brazingmaterials such as gold brazing filler and silver brazing filler, variousmetal bumps such as gold bumps and silver bumps, and various conductiveadhesives in which a conductive filler is dispersed in a resin-basedadhesive can be used.

Although the angular velocity sensors 3 x, 3 y, and 3 z are describedabove, the configurations of the angular velocity sensors 3 x, 3 y, and3 z are not particularly limited. For example, the physical quantitydetection element 34 may be formed of a capacitive silicon vibrationelement and detect the angular velocity based on a change incapacitance. At least one of the angular velocity sensors 3 x, 3 y, and3 z may be different from the other angular velocity sensors. In thefirst electronic component 3, at least one of the angular velocitysensors 3 x, 3 y, and 3 z may be omitted. The first electronic component3 may be a physical quantity sensor that detects a physical quantityother than the angular velocity, or may not be a physical quantitysensor. The first electronic component 3 does not have to be a packagedsurface mount component. For example, the package 31 may be omitted andthe physical quantity detecting element 34 may be exposed in the cap 8.

As shown in FIG. 3 , the cap 8 is bonded to the substrate 2, andaccommodates the angular velocity sensors 3 x, 3 y, and 3 z between thecap 8 and the substrate 2. The cap 8 has a hat shape, and includes abase portion 81 having a recess 811 that opens to the upper surface 21side, and an annular flange portion 82 protruding from a lower endportion of the base portion 81 toward an outer peripheral side. The cap8 is disposed on the upper surface 21 of the substrate 2 so as toaccommodate the angular velocity sensors 3 x, 3 y, and 3 z in the recess811. The flange portion 82 is in contact with the upper surface 21.Then, the cap 8 and the substrate 2 are bonded to each other by the moldportion 9, and the inside of the recess 811 is hermetically sealed.

In this way, by providing the cap 8 that accommodates the angularvelocity sensors 3 x, 3 y, and 3 z, the angular velocity sensors 3 x, 3y, and 3 z can be protected from moisture, dust, impact, and the like.In the present embodiment, the inside of the recess 811 is air-sealed.The present disclosure is not limited thereto. For example, sealingunder reduced pressure or sealing under positive pressure may beperformed, or the gas may be replaced with a stable gas such as nitrogenor argon.

The cap 8 has conductivity and is formed of, for example, a metalmaterial. In particular, in the present embodiment, the cap 8 is formedof a 42 alloy which is an iron-nickel alloy. Accordingly, the linearexpansion coefficient difference between the substrate 2 formed of theceramic substrate and the cap 8 can be made sufficiently small.Generation of thermal stress due to the linear expansion coefficientdifference can be effectively prevented. Therefore, the electronicdevice 1 is hardly affected by an environmental temperature and hasstable characteristics. The cap 8 is coupled to aground (GND) when theelectronic device 1 is used. Accordingly, the cap 8 functions as ashield that blocks electromagnetic noise from the outside. Driving ofthe angular velocity sensors 3 x, 3 y, and 3 z accommodated in the cap 8is stabilized. A constituent material of the cap 8 is not limited to the42 alloy. For example, a metal material such as a SUS material, variousceramic materials, various resin materials, a semiconductor materialsuch as silicon, and various glass materials can also be used.

Here, as a method of bonding the cap 8 and the substrate 2, there is amethod of using an adhesive disposed between the flange portion 82 andthe substrate 2, particularly an adhesive containing an organiccomponent such as a resin-based adhesive. However, in the presentembodiment, such a method is not adopted, and the cap 8 and thesubstrate 2 are bonded by the mold portion 9. Accordingly, it ispossible to reduce a height of the electronic device 1 as compared withthe method in which the adhesive is disposed between the flange portion82 and the substrate 2. There is no risk that the inside of the cap 8may be contaminated by outgas containing the organic component generatedfrom the adhesive. It is also possible to prevent a decrease in thereliability due to aged deterioration of the adhesive. Therefore, theelectronic device 1 is small and has high reliability. Further, since noadhesive is used, the manufacturing cost of the electronic device 1 canbe reduced. The method of bonding the cap 8 and the substrate 2 is notparticularly limited.

In the electronic device 1, the recess 811 is a gap and is not filledwith the mold portion 9. That is, the angular velocity sensors 3 x, 3 y,and 3 z accommodated in the cap 8 are not covered with the mold portion9. Therefore, the problem described in the related art, that is, theproblem that the mold material cannot be fully filled in the gap formedbetween the angular velocity sensors 3 x, 3 y, and 3 z and the substrate2 due to the thickness of the first joining member B1, and a minute gapis formed in the portion does not occur. Therefore, even if the firstbonding member B1 is melted by heat applied when the electronic device 1solder-mounted on an external substrate, unlike the related art, wettingand spreading of the melted first bonding member B1 to an unintendedportion is prevented. Therefore, it is possible to prevent theoccurrence of electrical defects such as a short circuit, adisconnection, and an increase in wiring resistance.

As shown in FIGS. 2 and 3 , the second electronic component 4 includesthe acceleration sensor 5 and the circuit element 6. Since theelectronic device 1 includes the circuit element 6, the angular velocitysensors 3 x, 3 y, and 3 z and the acceleration sensor 5 can be coupledto the circuit element 6 in the electronic device 1. Therefore, a wiringlength for coupling the components can be shortened. Therefore, inparticular, noise is less likely to be added to detection signals outputfrom the angular velocity sensors 3 x, 3 y, and 3 z and the accelerationsensor 5, and the angular velocity around each axis and the accelerationin each axis direction can be more accurately detected.

As shown in FIG. 3 , the acceleration sensor 5 is bonded to the lowersurface 22 via a second bonding member B2 on an upper surface thereof,that is, a second relative surface 50 relative to the lower surface 22of the substrate 2. The circuit element 6 is bonded to the lower surfaceof the acceleration sensor 5 via a third bonding member B3 on an uppersurface thereof, that is, a third relative surface 60 relative to thelower surface of the acceleration sensor 5. In the present embodiment,since a shape of the acceleration sensor 5 in the plan view is largerthan a shape of the circuit element 6 in the plan view, the accelerationsensor 5 is bonded to the substrate 2, and the circuit element 6 isbonded to the acceleration sensor 5. Accordingly, the accelerationsensor 5 and the circuit element 6 can be disposed on the substrate 2 ina well-balanced manner.

Here, the second bonding member B2 and the third bonding member B3 arenot electrically coupled. Therefore, as the second bonding member B2 andthe third bonding member B3, for example, various die attach agents, andvarious die attach films can be used regardless of whether the secondbonding member B2 and the third bonding member B3 are conductive or not.

The acceleration sensor 5 is a three-axis acceleration sensor capable ofindependently detecting an acceleration in the X axis direction, anacceleration in the Y axis direction, and an acceleration in the Z axisdirection. That is, the electronic device 1 is a six-axis compositesensor capable of detecting the angular velocity around each axis of theX axis, the Y axis, and the Z axis and the acceleration in each axisdirection. In this way, by making the electronic device 1 usable as thephysical quantity sensor, the electronic device 1 can be mounted onvarious electronic components and has high convenience and demand.

The acceleration sensor 5 includes a package 51 and sensor elements 54,55, and 56 accommodated in the package 51. The package 51 includes abase 52 having a recess 521 formed so as to overlap the sensor elements54, 55, and 56, and a lid 53 having a recess 531 that opens to a base 52side and bonded to the base 52 so as to accommodate the sensor elements54, 55, and 56 in the recess 531. A part of a lower surface of the base52 is exposed from the lid 53. A plurality of mounting terminals 59electrically coupled to the sensor elements 54, 55, and 56 are disposedin the exposed part.

The sensor element 54 is an element that detects the acceleration in theX axis direction. The sensor element 55 is an element that detects theacceleration in the Y axis direction. The sensor element 56 is anelement that detects the acceleration in the Z axis direction. Each ofthe sensor elements 54, 55, and 56 is a silicon vibration elementincluding a fixed electrode fixed to the base 52 and a movable electrodevariable with respect to the base 52. When the acceleration in thedetection axis direction is received, the movable electrode is displacedwith respect to the fixed electrode, and the capacitance formed betweenthe fixed electrode and the movable electrode changes. Therefore, achange in the capacitance of each of the sensor elements 54, 55, and 56is extracted as the detection signal. The acceleration in each axisdirection can be obtained based on the extracted detection signal.

Although the acceleration sensor 5 is described above, the configurationof the acceleration sensor 5 is not particularly limited as long as theacceleration sensor 5 can exhibit its function. For example, the sensorelements 54, 55, and 56 are not limited to the silicon vibrationelements, and may be, for example, crystal vibration elements, and maybe constituted to detect the acceleration based on the electric chargegenerated by vibration.

The circuit element 6 is an unpackaged semiconductor chip, that is, abare chip. Accordingly, it is possible to reduce size and cost of thecircuit element 6. The circuit element 6 is not limited to the barechip, and may be a packaged element. The circuit element 6 includes acontrol circuit 61 that controls driving of the angular velocity sensors3 x, 3 y, and 3 z and the acceleration sensor 5, and an interfacecircuit 62 that performs communication with the outside. The controlcircuit 61 independently controls the driving of the angular velocitysensors 3 x, 3 y, and 3 z and the acceleration sensor 5, andindependently detects the angular velocity around each axis of the Xaxis, the Y axis, and the Z axis and the acceleration in each axisdirection based on the detection signals output from the angularvelocity sensors 3 x, 3 y, and 3 z and the acceleration sensor 5. Theinterface circuit 62 transmits and receives signals, receives a commandfrom an external device, and outputs the detected angular velocity andacceleration to the external device. A communication method of theinterface circuit 62 is not particularly limited. In the presentembodiment, serial peripheral interface (SPI) communication is used. TheSPI communication is a communication method suitable for coupling aplurality of sensors. Since all signals related to the angular velocityand the acceleration can be output from one lead 71, pin saving of theelectronic device 1 can be achieved.

The circuit element 6 includes a plurality of second mounting terminals69 disposed on a lower surface thereof. The circuit element 6 iselectrically coupled to the acceleration sensor 5 and the second wiringpattern 29 via a bonding wire BW. Accordingly, the circuit element 6 iselectrically coupled to the angular velocity sensors 3 x, 3 y, and 3 z,the acceleration sensor 5, and the lead 71.

The lead group 7 is located on the lower surface 22 side of thesubstrate 2, and includes a plurality of leads 71 bonded to thesubstrate 2 via a conductive fourth bonding member B4. The plurality ofleads 71 are provided substantially uniformly along the four sides ofthe substrate 2. At least a part of the plurality of leads 71 iselectrically coupled to the second wiring pattern 29 via the fourthbonding member B4, and is electrically coupled to the circuit element 6via the second wiring pattern 29 and the bonding wire BW. The fourthbonding member B4 is solder, and performs mechanical coupling andelectrical coupling between the lead 71 and the substrate 2 by solderreflow. Accordingly, it is possible to easily and accurately couple thelead 71 and the substrate 2. The fourth bonding member B4 is lessdeteriorated over time and has high reliability. The fourth bondingmember B4 is not limited to solder. For example, various brazingmaterials such as gold brazing filler and silver brazing filler, variousmetal bumps such as gold bumps and silver bumps, and various conductiveadhesives in which a conductive filler is dispersed in a resin-basedadhesive can be used.

A free end portion of each lead 71 protrudes to the outside of the moldportion 9, and the lead 71 is attached to the external device at thisportion. That is, the electronic device 1 is a quad flat package (QFP).In the present embodiment, each lead 71 protruding from the mold portion9 is bent downward in the middle thereof. However, the shape of eachlead 71 is not particularly limited, and may be, for example, straightor bent upward. The electronic device 1 is not limited to the QFP, andmay be, for example, a plastic leaded chip carrier (PLCC) in which thelead 71 protruding from the mold portion 9 is folded back to the lowerside of the substrate 2.

The mold portion 9 molds the acceleration sensor 5 and the circuitelement 6, and protects the acceleration sensor 5 and the circuitelement 6 from moisture, dust, impact, and the like. The mold portion 9molds a coupling portion between the substrate 2 and each lead 71, andprotects the coupling portion from moisture, dust, impact, and the like.The mold portion 9 bonds the cap 8 and the substrate 2. A mold materialconstituting the mold portion 9 is not particularly limited. Forexample, a thermosetting epoxy resin or a curable resin material can beused. The mold portion 9 can be formed by, for example, a transfermolding method.

Here, as described above, the second electronic component 4 covered withthe mold portion 9 is electrically coupled by the bonding wire BW.Therefore, even if the minute gap is formed in the mold portion 9without being filled with the mold material and the second and thirdbonding members B2 and B3 melted by heat at the time of solder-mountingwet and spread in the minute gap, the electrical defects such as theshort circuit, the disconnection, and the increase in the wiringresistance do not substantially occur.

The mold portion 9 includes a base portion 91 that is located on thelower surface 22 side of the substrate 2 and molds the second electroniccomponent 4, and a fixing portion 92 that is located on the side of thesubstrate 2, molds a coupling portion between the substrate 2 and thelead 71, and bonds the substrate 2 and the cap 8. The fixing portion 92has a substantially C-shaped cross section, bypasses the side of thesubstrate 2 from the lower surface 22 of the substrate 2 and goes aroundto the upper surface 21 side, and molds the flange portion 82 of the cap8 to bond the substrate 2 and the cap 8.

According to such a configuration, as described above, it is notnecessary to dispose the adhesive between the substrate 2 and the cap 8when the substrate 2 and the cap 8 are bonded to each other. Therefore,the height of the electronic device 1 can be reduced. There is no riskthat the inside of the cap 8 may be contaminated by the outgas generatedfrom the adhesive. Therefore, the electronic device 1 is small and hashigh reliability. In particular, by molding the flange portion 82, thegap between the cap 8 and the substrate 2 can be closed by the moldmaterial, so that the inside of the cap 8 can be hermetically sealedmore reliably.

The mold portion 9 molds only from a central portion to an outerperipheral side end portion of the flange portion 82, and a portion onthe inner peripheral side of the flange portion 82 is not molded. Thatis, the flange portion 82 includes a mold region 821 covered with themold portion 9 and a non-mold region 822 not covered with the moldportion 9. The mold region 821 is provided on the outer peripheral sideof the flange portion 82 with respect to the non-mold region 822. Byforming the non-mold region 822 in the flange portion 82 in this way, aswill be described later, when the mold portion 9 is formed, the cap canbe easily supported by the mold, the manufacturing of the electronicdevice 1 is facilitated, and accuracy thereof is improved.

Next, a method of manufacturing the electronic device 1 will bedescribed. As shown in FIG. 4 , the manufacturing step of the electronicdevice 1 includes a preparation step S1 of preparing the substrate 2 onwhich the first electronic component 3 and the second electroniccomponent 4 are mounted and to which the leads 71 are bonded, a moldingstep S2 of forming the mold portion 9 in a state where the substrate 2is covered with the cap 8, and a lead shaping step S3 of shaping theleads 71.

Preparation Step S1

First, the substrate 2 is prepared in which the first wiring pattern 28is formed on the upper surface 21, the second wiring pattern 29 isformed on the lower surface 22, and the first wiring pattern 28 and thesecond wiring pattern 29 are electrically coupled to each other by athrough electrode which is not shown. Next, a lead frame 70 shown inFIG. 5 is prepared. The lead frame 70 includes a frame-shaped frame 73,the plurality of leads 71 located inside the frame 73 and supported bythe frame 73, and tie bars 74 coupling the plurality of leads 71.

Next, as shown in FIG. 6 , the leads 71 are bonded to the lower surface22 of the substrate 2 via the fourth bonding member B4. Specifically, acleaning solder paste is used as the fourth bonding member B4. The leads71 are bonded to the substrate 2 by the solder reflow. A narrowconstriction portion is formed on an immediate tip end side of thebonding portion of each lead 71 to the substrate 2. Accordingly, it ispossible to prevent wetting and spreading of the fourth bonding memberB4 to the tip end side of the lead 71 at the time of the solder reflow.

Next, a flux residue generated by the solder reflow is cleaned andremoved. Accordingly, the mold material is easily filled in the portion,so that the mold portion 9 with higher accuracy can be formed. It isalso possible to effectively prevent corrosion or the like caused byre-melting of the flux residue at the time of subsequent solder reflow.

Next, the angular velocity sensors 3 x, 3 y, and 3 z are prepared, andare mounted on the upper surface 21 of the substrate 2 via the firstbonding member B1 as shown in FIG. 7 . Specifically, a non-cleaningsolder paste is used as the first bonding member B1. The angularvelocity sensors 3 x, 3 y, and 3 z are bonded to the substrate 2 by thesolder reflow. Unlike the case of the lead 71, the flux residuegenerated by the solder reflow is not cleaned and removed, and a soldermounting surface is kept covered with the flux residue. Accordingly,contact between the portion and the atmosphere can be prevented, andcorrosion of the portion can be effectively prevented.

As described above, after the leads 71 are bonded to the substrate 2 bythe solder reflow, the angular velocity sensors 3 x, 3 y, and 3 z arebonded to the substrate 2 by the solder reflow, so that thermal damageto the angular velocity sensors 3 x, 3 y, and 3 z can be reduced.Therefore, it is possible to effectively prevent deterioration orfluctuation of the characteristics of each of the angular velocitysensors 3 x, 3 y, and 3 z.

Next, the acceleration sensor 5 and the circuit element 6 are prepared.As shown in FIG. 8 , the acceleration sensor 5 is bonded to the lowersurface 22 of the substrate 2 via the second bonding member B2. Thecircuit element 6 is bonded to the lower surface of the accelerationsensor 5 via the third bonding member B3. As the second and thirdbonding members B2 and B3, the die attach agent, the die attach film, orthe like can be used.

After curing of the second and third bonding members B2 and B3 iscompleted, the bonding wire BW is formed to electrically couple eachportion. A wire bonding step can be performed, for example, in a statewhere the substrate 2 is mounted on a heater block 1100 having a recessfor preventing interference with the angular velocity sensors 3 x, 3 y,and 3 z, and the substrate 2 is fixed by a clamper 1200. A heatingtemperature of the substrate 2 is set to a relatively low temperature,for example, about 180° C. or more and 200° C. or less. Accordingly,thermal damage to the angular velocity sensors 3 x, 3 y, and 3 z, theacceleration sensor 5, and the circuit element 6 can be reduced.

Molding Step S2

Next, the substrate 2 is molded in a state where the substrate 2 iscovered with the cap 8 to form the mold portion 9. In this step, a mold2000 shown in FIG. 9 is used. The mold 2000 includes a lower mold 2100and an upper mold 2200.

The lower mold 2100 includes a cap mounting portion 2110 on which thecap 8 is mounted, a mold material filling portion 2130 that is locatedoutside the cap mounting portion 2110 and forms a space to be filledwith the mold material, and a lead support portion 2140 that is locatedoutside the mold material filling portion 2130 and supports the lead 71.

The cap mounting portion 2110 includes a recess 2111 that opens on anupper surface side of the lower mold 2100 and has a shape conforming toan outer shape of the base portion 81 of the cap 8, and a supportportion 2112 that is located outside the recess 2111 and supports theflange portion 82 of the cap 8 from below. In a state in which the cap 8is mounted in the cap mounting portion 2110, the support portion 2112comes into contact with the non-mold region 822 of the flange portion82, that is, a portion from the central portion to the inner peripheralside end portion of the flange portion 82, and supports the portion frombelow. In this way, by supporting the flange portion 82 located at anouter edge portion of the cap 8, a posture of the cap 8 is stabilized.Further, since the flange portion 82 is also a portion that comes intocontact with the substrate 2, a posture of the substrate 2 mounted onthe cap 8 is stabilized by supporting the flange portion 82. Therefore,the substrate 2 can be accurately located with respect to the cap 8.What is important here is that the support portion 2112 does not comeinto contact with the mold region 821 of the flange portion 82, that is,the portion from the central portion to the outer peripheral side endportion of the flange portion 82.

The mold material filling portion 2130 is constituted by a recessrecessed from the support portion 2112, and overlaps the mold region 821of the flange portion 82, that is, the portion from the central portionto the outer peripheral side end portion of the flange portion 82 in theplan view. The mold material filling part 2130 forms a gap for pouringthe mold material between the mold region 821 of the flange portion 82and the lower mold 2100. The lead support portion 2140 is located belowthe lead 71 and supports the lead 71 by sandwiching the lead 71 betweenthe lead support portion 2140 and the upper mold 2200. In a state inwhich the substrate 2 is merely mounted on the lower mold 2100, that is,in a state in which the upper mold 2200 is not set, the lead supportportion 2140 is not in contact with the lead 71, and a gap G is formedtherebetween.

On the other hand, the upper mold 2200 includes a mold material fillingportion 2210 that forms a space for filling the mold material around thesecond electronic component 4, and a lead pressing portion 2220 that islocated outside the mold material filling portion 2210 and presses thelead 71 toward the lead support portion 2140. The mold material fillingportion 2210 is constituted by a recess that opens to a lower surfaceside. In a state in which the upper mold 2200 is set in the lower mold2100, the second electronic component 4 and a base end portion of eachlead 71 are accommodated in the recess. Further, the mold materialfilling portion 2210 is coupled to the mold material filling portion2130 at an outer edge portion thereof. One space to be filled with themold material is formed by the mold material filling portions 2210 and2130.

In this step, first, the cap 8 is mounted in the cap mounting portion2110, and then the substrate 2 is mounted on the cap 8. The cap 8 may bemounted in the cap mounting portion 2110 after the substrate 2 ismounted on the cap 8.

Next, as shown in FIG. 10 , the upper mold 2200 is set on the lower mold2100. In a state where the upper mold 2200 is set on the lower mold2100, the lead 71 is pressed toward the lead support portion 2140 by thelead pressing portion 2220 and is pressed against the lead supportportion 2140. Since the gap G is formed between the lead 71 and the leadsupport portion 2140, the lead 71 is elastically deformed downward andis sandwiched between the lead support portion 2140 and the leadpressing portion 2220 in this state. Therefore, a restoring force F forreturning to a natural state is generated in the lead 71, and thesubstrate 2 is biased toward the cap 8 by the restoring force F and ispressed against the cap 8. Accordingly, the cap 8 and the substrate 2are brought into close contact with each other. Therefore, intrusion ofthe mold material into the cap 8 can be effectively prevented, and thecap 8 can be hermetically sealed more reliably.

In this state, the mold material filling portions 2210 and 2130 arefilled with the heated and softened mold material, and the mold portion9 is formed by cooling and curing the mold material. Accordingly, themold portion 9 that covers the second electronic component 4 and bondsthe cap 8 and the substrate 2 is formed. In particular, since the moldregion 821 is located on the outer peripheral side of the flange portion82 with respect to the non-mold region 822, the bonding of the cap 8 andthe substrate 2 and the hermetical sealing of the cap 8 can be easilyand more reliably performed.

Lead Shaping Step S3

Next, the frame 73 is removed from the lead frame 70, and the lead 71 isbent into a predetermined shape. Next, the tie bar 74 coupling the leads71 to each other is cut by a laser, a trim mold, or the like.Accordingly, the electronic device 1 shown in FIG. 1 is manufactured.

According to such a manufacturing method, it is possible to more easilymanufacture the electronic device 1 in which the electrical defects suchas the short circuit, the disconnection, and the increase in the wiringresistance are less likely to occur.

The configuration and the manufacturing method of the electronic device1 are described above. As described above, the electronic device 1includes: the substrate 2 having the upper surface 21 that is the firstsurface and the lower surface 22 that is the second surface, which arein the front and back relationship with each other, with the firstwiring pattern 28 being disposed on the upper surface 21 and the secondwiring pattern 29 being disposed on the lower surface 22; the firstelectronic component 3 mounted on the upper surface 21 of the substrate2; the second electronic component 4 mounted on the lower surface 22 ofthe substrate 2; and the mold portion that covers the second electroniccomponent 4 without covering the first electronic component 3. The firstelectronic component 3 includes the first mounting terminal 39 disposedon the first relative surface 320 relative to the upper surface 21, andis bonded to the upper surface 21 via the conductive first bondingmember B1 on the first relative surface 320, and the first mountingterminal 39 and the first wiring pattern 28 are electrically coupled toeach other via the first bonding member B1. The second electroniccomponent 4 includes the second mounting terminal 69, and is bonded tothe lower surface 22 via the second bonding member B2 on the secondrelative surface 50 relative to the lower surface 22, and the secondmounting terminal 69 and the second wiring pattern 29 are electricallycoupled to each other via the bonding wire BW which is a conductivewire.

Accordingly, the problem described in the related art, that is, theproblem that the mold material cannot be fully filled in the gap formedbetween the angular velocity sensors 3 x, 3 y, and 3 z and the substrate2 due to the thickness of the first joining member B1, and a minute gapis formed in the portion does not occur. Therefore, even if the firstbonding member B1 is melted by heat applied when the electronic device 1is solder-mounted on the external substrate, unlike the related art, itis possible to effectively prevent wetting and spreading of the meltedfirst bonding member B1 to an unintended portion, and it is possible toeffectively prevent the occurrence of the electrical defects such as theshort circuit, the disconnection, and the increase in the wiringresistance.

As described above, the first bonding member B1 is solder. Accordingly,mechanical coupling and electrical coupling between the angular velocitysensors 3 x, 3 y, and 3 z and the substrate 2 can be performed by thesolder reflow. Therefore, the coupling can be easily and accuratelyperformed. The first bonding member B1 is less deteriorated over time.Therefore, the manufacturing of the electronic device 1 is facilitated,and the reliability of the electronic device 1 is improved.

As described above, the angular velocity sensors 3 x, 3 y, and 3 z,which are the first electronic component 3, are packaged surface mountcomponents. Accordingly, the angular velocity sensors 3 x, 3 y, and 3 zare excellent in the mechanical strength and easy to be mounted on thesubstrate 2. The second electronic component 4 includes the circuitelement 6 electrically coupled to the angular velocity sensors 3 x, 3 y,and 3 z. Accordingly, the angular velocity sensors 3 x, 3 y, and 3 z andthe circuit element 6 can be coupled in the electronic device 1, and thewiring for coupling the angular velocity sensors 3 x, 3 y, and 3 z andthe circuit element 6 can be shortened. Therefore, noise is less likelyto be added to the detection signals output from the angular velocitysensors 3 x, 3 y, and 3 z, and the angular velocity around each axis canbe accurately detected.

As described above, the circuit element 6 is a bare chip. Accordingly,it is possible to reduce the size and the cost of the circuit element 6.

As described above, the angular velocity sensors 3 x, 3 y, and 3 z arephysical quantity sensors each including the package 31 and the physicalquantity detection element 34 accommodated in the package 31. Thecircuit element 6 includes the interface circuit 62 that communicateswith the outside. Accordingly, the electronic device 1 can be mounted onvarious electronic components and has high convenience and demand.

As described above, the first electronic component 3, which is thephysical quantity sensor, is the angular velocity sensors 3 x, 3 y, and3 z. The second electronic component 4 includes the acceleration sensor5 in addition to the circuit element 6. The acceleration sensor 5 isbonded to the lower surface 22. The circuit element 6 is bonded to theacceleration sensor 5. The circuit element 6 is electrically coupled tothe angular velocity sensors 3 x, 3 y, and 3 z and the accelerationsensor 5 via the bonding wire BW. Accordingly, the electronic device 1can be used as a composite sensor capable of independently detecting theangular velocity and the acceleration. Therefore, the electronic device1 can be mounted on various electronic components and has highconvenience and demand. Since the shape of the acceleration sensor 5 inthe plan view is larger than the shape of the circuit element 6 in theplan view, the acceleration sensor 5 and the circuit element 6 can bedisposed in a well-balanced manner by bonding the acceleration sensor 5to the lower surface 22 and bonding the circuit element 6 to theacceleration sensor 5.

As described above, the electronic device 1 includes the plurality ofleads 71 bonded to the substrate 2 and electrically coupled to thesecond wiring pattern 29. The coupling portion between the substrate 2and the leads 71 is covered with the mold portion 9. Accordingly, it ispossible to protect the coupling portion from moisture, dust, impact,and the like.

As described above, the electronic device 1 includes the cap 8 whichincludes the base portion 81 having the recess 811 that opens to theupper surface 21 side, and the flange portion 82 protruding from the endportion of the base portion 81 on the upper surface 21 side, which isdisposed on the upper surface 21 so as to accommodate the firstelectronic component 3 in the recess 811, and in which the flangeportion 82 is in contact with the upper surface 21. The flange portion82 is bonded to the substrate 2 by the mold portion 9. Accordingly, theheight of the electronic device 1 can be reduced. It is also possible toprevent contamination of the inside of the cap 8. Therefore, theelectronic device 1 is small and has high reliability.

As described above, the substrate 2 is a ceramic substrate. Accordingly,the substrate 2 having high corrosion resistance is obtained. Thesubstrate 2 having excellent mechanical strength is obtained. Therefore,the electronic device 1 having excellent long-term reliability isobtained.

Second Embodiment

FIG. 11 is a cross-sectional view showing an electronic device accordingto a second embodiment.

The present embodiment is the same as the first embodiment describedabove except that the arrangement of the acceleration sensor 5 and thecircuit element 6 is different. In the following description, thepresent embodiment will be described with a focus on the difference fromthe above embodiment, and a description of similar matters will beomitted. In FIG. 11 , the same reference numerals are given toconfigurations similar to those according to the above embodiment.

As shown in FIG. 11 , in the electronic device 1 according to thepresent embodiment, the circuit element 6 is bonded to the lower surface22 via the second bonding member B2 on the upper surface thereof, thatis, a second relative surface 600 relative to the lower surface 22 ofthe substrate 2. The acceleration sensor 5 is bonded to the lowersurface of the circuit element 6 via the third bonding member B3 on theupper surface thereof, that is, a third relative surface 500 relative tothe lower surface of the circuit element 6. In the present embodiment,since a shape of the circuit element 6 in a plan view is larger than ashape of the acceleration sensor 5 in the plan view, the circuit element6 is bonded to the substrate 2, and the acceleration sensor 5 is bondedto the circuit element 6. Accordingly, the acceleration sensor 5 and thecircuit element 6 can be disposed on the substrate 2 in a well-balancedmanner.

As described above, in the electronic device 1 according to the presentembodiment, the first electronic component 3, which is a physicalquantity sensor, is the angular velocity sensors 3 x, 3 y, and 3 z. Thesecond electronic component 4 includes the acceleration sensor 5 inaddition to the circuit element 6. The circuit element 6 is bonded tothe lower surface 22. The acceleration sensor 5 is bonded to the circuitelement 6. The circuit element 6 is electrically coupled to the angularvelocity sensors 3 x, 3 y, and 3 z and the acceleration sensor 5 via thebonding wire BW. Accordingly, the electronic device 1 can be used as acomposite sensor capable of independently detecting the angular velocityand the acceleration. Therefore, the electronic device 1 can be mountedon various electronic components and has high convenience and demand.Since the shape of the circuit element 6 in the plan view is larger thanthe shape of the acceleration sensor 5 in the plan view, the circuitelement 6 and the acceleration sensor 5 can be disposed in thewell-balanced manner by bonding the circuit element 6 to the lowersurface 22 and bonding the acceleration sensor 5 to the circuit element6.

Even with such a second embodiment, the same effects as those of thefirst embodiment can be exerted.

Third Embodiment

FIG. 12 is a cross-sectional view showing an electronic device accordingto a third embodiment.

The present embodiment is the same as the second embodiment describedabove except that the second electronic component 4 is electricallycoupled to the second wiring pattern 29 via the second bonding member B2instead of the bonding wire BW. In the following description, thepresent embodiment will be described with a focus on the difference fromthe above embodiments, and a description of similar matters will beomitted. In FIG. 12 , the same reference numerals are given toconfigurations similar to those according to the above embodiments.

As shown in FIG. 12 , in the circuit element 6 according to the presentembodiment, a plurality of second mounting terminals 69 are disposed notonly on the lower surface but also on the second relative surface 600relative to the lower surface 22 of the substrate 2. The circuit element6 is bonded to the lower surface 22 of the substrate 2 via theconductive second bonding member B2 on the second relative surface 600.The second mounting terminal 69 is electrically coupled to the secondwiring pattern 29 via the second bonding member B2. The second bondingmember B2 is various metal bumps such as gold bumps and silver bumps.Accordingly, it is possible to easily and accurately couple the circuitelement 6 and the substrate 2.

The second bonding member B2 has a melting point higher than that of thesolder as the first bonding member B1. More specifically, the secondbonding member B2 has such a melting point that the second bondingmember B2 is not melted by heat applied during a manufacturing step ofthe electronic device 1 or during solder reflow when the electronicdevice 1 is solder-mounted. The melting point of the second bondingmember B2 is not particularly limited, and is preferably higher than themelting point of the solder as the first bonding member B1 by 50° C. ormore, and more preferably by 100° C. or more. Accordingly, it ispossible to effectively prevent melting of the second bonding member B2at the time of the solder reflow.

By setting a melting point of the second bonding member B2 to be higherthan a melting point of the solder which is the first bonding member B1,the following effects can be exerted. In the present embodiment, a gapG1 is formed between the circuit element 6 and the substrate 2 by athickness of the second bonding member B2. Therefore, similarly to therelated art, the gap G1 is not sufficiently filled with the moldmaterial, and a minute gap may be generated in the portion. However, thesecond bonding member B2 does not melt even by solder reflow, and doesnot wet and spread in the minute gap. Therefore, it is possible toeffectively prevent the occurrence of electrical defects such as a shortcircuit, a disconnection, and an increase in wiring resistance.

The electronic device 1 is described above. The electronic device 1includes: the substrate 2 having the upper surface 21 that is the firstsurface and the lower surface 22 that is the second surface, which arein the front and back relationship with each other, with the firstwiring pattern 28 being disposed on the upper surface 21 and the secondwiring pattern 29 being disposed on the lower surface 22; the firstelectronic component 3 mounted on the upper surface 21 of the substrate2; the second electronic component 4 mounted on the lower surface 22 ofthe substrate 2; and the mold portion 9 that covers the secondelectronic component 4 without covering the first electronic component3. The first electronic component 3 includes the first mounting terminal39 disposed on the first relative surface 320 relative to the uppersurface 21, and is bonded to the upper surface 21 via the conductivefirst bonding member B1 on the first relative surface 320, and the firstmounting terminal 39 and the first wiring pattern 28 are electricallycoupled to each other via the first bonding member B1. The secondelectronic component 4 includes the second mounting terminal 69 disposedon the second relative surface 600 relative to the lower surface 22, andis bonded to the lower surface 22 on the second relative surface 600 viathe conductive second bonding member B2 having the melting point higherthan that of the first bonding member B1, and the second mountingterminal 69 and the second wiring pattern 29 are electrically coupled toeach other via the second bonding member B2.

Accordingly, even if the mold material cannot be fully filled into thegap formed between the circuit element 6 and the substrate 2 due to thethickness of the second bonding member B2, and a minute gap is formed atthe portion, it is possible to prevent the wetting and spreading of thesecond bonding member B2 in the minute gap. Therefore, it is possible toeffectively prevent the occurrence of the electrical defects such as theshort circuit, the disconnection, and the increase in the wiringresistance.

As described above, the second bonding member B2 is a metal bump.Accordingly, it is possible to easily and accurately couple the circuitelement 6 and the substrate 2.

Even in such a third embodiment as described above, the same effects asin the above described first embodiment can be obtained.

As mentioned above, although the electronic device according to thepresent disclosure is described based on illustrated embodiments, thepresent disclosure is not limited thereto. A configuration of each partcan be replaced with any configuration having a similar function.Further, any other constituents may be added to the present disclosure.The embodiments may be combined as appropriate.

What is claimed is:
 1. An electronic device comprising: a substratehaving a first surface and a second surface that are in a front and backrelationship with each other, a first wiring pattern being disposed onthe first surface, and a second wiring pattern being disposed on thesecond surface; a first electronic component mounted on the firstsurface of the substrate; a second electronic component mounted on thesecond surface of the substrate; and a mold portion that covers thesecond electronic component without covering the first electroniccomponent, wherein the first electronic component includes a firstmounting terminal disposed on a first relative surface relative to thefirst surface, and is bonded to the first surface on the first relativesurface via a conductive first bonding member, and the first mountingterminal and the first wiring pattern are electrically coupled to eachother via the first bonding member, the second electronic componentincludes a second mounting terminal, and is bonded to the second surfacevia a second bonding member on a second relative surface relative to thesecond surface, and the second mounting terminal and the second wiringpattern are electrically coupled to each other via a conductive wire,and the conductive wire is embedded within the mold portion.
 2. Theelectronic device according to claim 1, wherein the first bonding memberis solder.
 3. The electronic device according to claim 1, wherein thefirst electronic component is a packaged surface mount component, andthe second electronic component includes a circuit element electricallycoupled to the surface mount component.
 4. The electronic deviceaccording to claim 3, wherein the circuit element is a bare chip.
 5. Theelectronic device according to claim 1, further comprising: a pluralityof leads bonded to the substrate and electrically coupled to the secondwiring pattern, wherein a coupling portion between the substrate and theleads is covered with the mold portion.
 6. The electronic deviceaccording to claim 1, further comprising: a cap that has a base portionhaving a recess that opens to a first surface side, and a flange portionprotruding from an end portion of the base portion on the first surfaceside, that is disposed on the first surface so as to accommodate thefirst electronic component in the recess, and in which the flangeportion is in contact with the first surface, wherein the flange portionis bonded to the substrate by the mold portion.
 7. The electronic deviceaccording to claim 1, wherein the substrate is a ceramic substrate. 8.The electronic device according to claim 1, wherein the mold portiondirectly contacts the first surface of the substrate.
 9. An electronicdevice comprising: a substrate having a first surface and a secondsurface that are in a front and back relationship with each other, afirst wiring pattern being disposed on the first surface, and a secondwiring pattern being disposed on the second surface; a first electroniccomponent mounted on the first surface of the substrate; a secondelectronic component mounted on the second surface of the substrate; anda mold portion that covers the second electronic component withoutcovering the first electronic component, wherein the first electroniccomponent includes a first mounting terminal disposed on a firstrelative surface relative to the first surface, and is bonded to thefirst surface on the first relative surface via a conductive firstbonding member, and the first mounting terminal and the first wiringpattern are electrically coupled to each other via the first bondingmember, the second electronic component includes a second mountingterminal disposed on a second relative surface relative to the secondsurface, and is bonded to the second surface on the second relativesurface via a conductive second bonding member having a melting pointhigher than that of the first bonding member, and the second mountingterminal and the second wiring pattern are electrically coupled to eachother via the second bonding member, and the second bonding member isembedded in the mold portion.
 10. The electronic device according toclaim 9, wherein the second bonding member is a metal bump.
 11. Theelectronic device according to claim 9, wherein the mold portiondirectly contacts the first surface of the substrate.
 12. An electronicdevice comprising: a substrate having a first surface and a secondsurface that are in a front and back relationship with each other, afirst wiring pattern being disposed on the first surface, and a secondwiring pattern being disposed on the second surface; a first electroniccomponent mounted on the first surface of the substrate; a secondelectronic component mounted on the second surface of the substrate; anda mold portion that covers the second electronic component withoutcovering the first electronic component, wherein the first electroniccomponent includes a first mounting terminal disposed on a firstrelative surface relative to the first surface, and is bonded to thefirst surface on the first relative surface via a conductive firstbonding member, and the first mounting terminal and the first wiringpattern are electrically coupled to each other via the first bondingmember, the second electronic component includes a second mountingterminal, and is bonded to the second surface via a second bondingmember on a second relative surface relative to the second surface, andthe second mounting terminal and the second wiring pattern areelectrically coupled to each other via a conductive wire, the firstelectronic component is a packaged surface mount component that is aphysical quantity sensor including a package and a physical quantitydetection element accommodated in the package, and the second electroniccomponent includes a circuit element electrically coupled to the surfacemount component and the circuit element includes an interface circuitthat communicates with the outside.
 13. The electronic device accordingto claim 12, wherein the physical quantity sensor is an angular velocitysensor, the second electronic component includes an acceleration sensorin addition to the circuit element, the acceleration sensor is bonded tothe second surface, and the circuit element is bonded to theacceleration sensor, and the circuit element is electrically coupled tothe angular velocity sensor and the acceleration sensor via a wire. 14.The electronic device according to claim 12, wherein the physicalquantity sensor is an angular velocity sensor, the second electroniccomponent includes an acceleration sensor in addition to the circuitelement, the circuit element is bonded to the second surface, and theacceleration sensor is bonded to the circuit element, and the circuitelement is electrically coupled to the angular velocity sensor and theacceleration sensor via a wire.
 15. The electronic device according toclaim 12, wherein the first bonding member is solder.
 16. The electronicdevice according to claim 12, further comprising: a plurality of leadsbonded to the substrate and electrically coupled to the second wiringpattern, wherein a coupling portion between the substrate and the leadsis covered with the mold portion.
 17. The electronic device according toclaim 12, further comprising: a cap that has a base portion having arecess that opens to a first surface side, and a flange portionprotruding from an end portion of the base portion on the first surfaceside, that is disposed on the first surface so as to accommodate thefirst electronic component in the recess, and in which the flangeportion is in contact with the first surface, wherein the flange portionis bonded to the substrate by the mold portion.
 18. The electronicdevice according to claim 12, wherein the substrate is a ceramicsubstrate.
 19. The electronic device according to claim 12, wherein thecircuit element is a bare chip.
 20. The electronic device according toclaim 12, wherein the mold portion directly contacts the first surfaceof the substrate.